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Capability of Rigid board
No.   Type   Standard
1   Normal FR4/Halogen free/
   High Tg FR4/ Aluminum
   KB,Shengyi, ITEQ,Isola, Nelco,Ventec,Tuc,Elite,
   Panasonic, Getek,NanYa, Bergquist,laird
2   PTFE Laminates   Rogers series、Taconic series、Arlon series、Nelco series、
   Taizhou Wangling F4BK series、TP series;
3   Hybrid laminating   Rogers/Taconic/Arlon/Nelco laminate with FR-4 material -
   including partial Ro4350B hybrid  laminating with FR-4
4   Layers   1-64 layers, board thickness 0.4mm-10mm
5   Buried/Blind Via   4-50 layers, board thickness 0.5mm-10mm
6   HDI   1+N+1、2+N+2、3+N+3、Anylayer HDI
7   Flex & Rigid-Flex PCB   1-12layers Flex PCB ,2-20layers
   Rigid-flex PCB HDI+Rigid-flex PCB
8   Soldermask Type(LPI)/
   Soldermask color
   kuangshun,Taiyo、
   Himonia,Nanya,Onstatic,Chung Yu,MSDS/Green,
   Yellow, Black, Blue, Red, White,Purple,Orange ,
   Matte Green,Matte Blue, Matte Black
9   Peelable Soldermask/color   PETER SD2955/Blue-Green
10   Carbon ink   Nipon
11   HASL/Lead Free HASL   Thickness: 0.5-40um
12   OSP   Entek Plus HT, Preflux F2 LX
13   ENIG (Ni-Au)   Au:0.03um≤max<0.06um     Ni:3um≤max≤6um
14   Electro-bondable Ni-Au   Au:0.2-1.0um Ni:2.54-10um
15   ENEIPG   Au: 0.015-0.075um     Pd 0.02-0.075um      Ni:2-6umm
16   Electro. Hard Gold   Au:5~50uin(0.125~1.27um);
   Nithickness:100~250uin     (2.50~6.25um)
17   Thick tin   1.0-1.4um
18   Copper thickness   12oz max.
19   Min Mechanical Drill Hole   0.15mm
20   Min. Laser Drill Hole   4mil (0.100mm)
21   Line Width/Spacing   2mil/2mil
22   Max. Panel Size   650mm X 1200mm
23   Line Width/Spacing Tolerance   Non electro coating:+/-5um,Electro coating:+/-10um
24   PTH Hole Tolerance   +/-0.002inch(0.050mm)
25   NPTH Hole Tolerance   +/-0.002inch(0.050mm)
26   Hole Location Tolerance   +/-0.002inch(0.050mm)
27   Hole to Edge Tolerance   +/-0.004inch(0.100mm)
28   Edge to Edge Tolerance   +/-0.004inch(0.100mm)
29   Layer to Layer Tolerance   +/-0.003inch(0.075mm)
30   Impedance Tolerance   +/- 10% /Max >50ohm +/- 5%
31   Warpage %   Max ≤0.5%
Capability of Rigid-flex board
No.   Item   Standard
1   Flex & Rigid-Flex PCB   1-30layers Flex PCB ,
   2-20layers Rigid-flex PCB HDI+Rigid-flex PCB
2   FCCL(adhesive)   Shengyi SF305:PI=0.5mil&1mil&2mil;
   Cu=0.33oz&0.5oz&1oz
3   FCCL(adhesiveless)   Panasonic R‐ F775(ER):
   PI=1mil&2mill;    Cu=0.33oz&0.5oz &1oz
   DuPont Pyralux AP:PI=1mil&2mil&3mil;   Cu= 0.5oz&1oz
4   Coverlay   Shengyi SF305C: 0515&0525&1025&2030
5   Adhesive   Taiflex BT: AD=10um&   25um& 40um
   shengyi SF302B:   AD=35um&40um
6   PI stiffener   Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil
7   3M   9077&6677&9458
8   NO FLOW PP   Ventec:VT‐47N(TG 170℃)&  EM‐285B(TG 150℃)
9   CCL   ITEQ: IT‐ 180A;   Shengyi: S1141& S1000‐2
10   Other CCL   Arlon: 85N; Rogers:  RO4000 series;
   Nelco:N4000‐ 13 series,  Ventec:VT‐901
11   Board thickness   0.3mm‐ 3.0mm
12   Tolerance of board thickness
   (thickness>1.0mm)
   ±10%
13   Tolerance of board thickness
   (thickness≤1.0mm)
   ±0.1mm
14   Min. board size   10mm*15mm
15   Max. board size   406.4mm*558.8mm
16   Impedance control tolerance   ±10%
17   Bow&twist   0.75%(symmetrical),
   2%(unsymmetrical)
18   Min. BGA pad size   12mil(8mil for electrical
   soft gold board)
19   Max. finished copper thickness   3oz
20   Max. buried via   0.4mm
21   Tolerance of non‐ plated holes   ±2mil(limited is +0/‐2mil or +2/‐0mil)
22   Solder mask color   green,blue,red, matte green, and so on
  23   Min. solder dam (copper≤1oz)   4mil(green, red and blue),  5mil(black and white)
  24   Min. solder dam (copper2‐4oz)   8mil
  25   Min. clearance   2.5mil (2.0mil)
  26   Surface treatment   HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold,
   Soft Gold,Hard Gold, Immersion silver, Immersion tin and OSP
   Thickness (ENIG)   0.05‐0.10um
  27   Nickel thickness (ENIG)   3‐ 8um
   Gold thickness  (ENEPIG)   0.05‐0.10um
  28   Palladium thickness (ENEPIG)   0.05‐0.15um
   Nickel thickness (ENEPIG)   3‐ 8um
  29   Hard gold thickness (leadless)   0.1‐ 1.5um
   Hard gold thickness   0.1‐4.0um
  30   Electrolytic Nickel thickness   ≥3um
   Electrolytic Gold thickness   0.05‐0.10um
  31   Immersion silver thickness   0.2‐0.4um
   OSP thickness   0.1‐0.3um
  32   Tolerance of board outline   ±6mil(exclude complicated board outline and cutout)